Die Bonding

A die is a small semiconductor chip that serves as a core component of electronic parts or integrated circuits.
Die bonding is a manufacturing process used in semiconductor packaging where the die or chip is attached to a substrate or package using materials such as epoxy. This process securely attaches the die to the package, providing electrical and mechanical connections, as well as enabling heat transfer between the package and the die.

Applicable Materials

Epoxy, Solder Paste, Conductive Adhesive, etc.

Underfill Dispensing

An underfill is a process that completely fills underneath packages such as BGA, CSP, and flip chips using insulating resin. It is positioned between the silicon chip and the organic substrate in electronic packaging, serving to redistribute stress and deformation caused by the difference in coefficients of thermal expansion between the chip and substrate. Additionally, it minimizes the electrical and magnetic environmental effects from moisture or other modules.

Applicable Materials

Epoxy, Anisotropic Conductive Film (ACF)

Encapsulation

The encapsulation process is a method of sealing semiconductor chips with specific materials to protect them from external environments. This process is especially essential in displays, particularly for OLEDs. Since OLEDs are highly sensitive to moisture and oxygen, the encapsulation process is crucial to prevent their penetration.

Applicable Materials

Silicone gel, Epoxy

Conformal Coating

Conformal coating is a process that forms a very thin protective layer on printed circuit boards (PCBs) or various electrical substrates to extend the lifespan of circuit components by shielding them from external environmental and physical impacts. This process protects PCBs from moisture and contamination, provides electrical insulation, prevents wire breaks, and inhibits corrosion of components and solder joints.

Applicable Materials

acrylic,silicone,polyurethane

Solder Paste Dispensing

Solder paste dispensing is a key equipment in the electronics industry that enhances the precision and reliability of PCB assembly. It is essential in modern electronic manufacturing, where miniaturization and high-density mounting are required. This process is primarily used in Surface Mount Technology (SMT) to accurately fix components onto substrates, with precision and speed being critical requirements.

Applicable Materials

Solder Paste

TIM Dispensing

Efficient management of heat generated in electronic devices is essential to prevent device damage, maintain performance, and extend lifespan. Inadequate thermal management can lead to component failures, reduced device performance, and increased power consumption. Thermal interface materials play a crucial role in enhancing the efficiency of heat management in electronic devices by improving heat transfer between components.

Applicable Materials

Thermal grease

Display

Dispensing equipment plays a crucial role in manufacturing high-resolution, high-quality displays such as OLED, LCD, and microLED in the display industry. Since this field requires precise processing and meticulous material handling, accurate material supply is essential for product performance and yield.

Acrylic resin, Urethane acrylate, Epoxy acrylate

Display

Dispensing equipment plays a crucial role in manufacturing high-resolution, high-quality displays such as OLED, LCD, and microLED in the display industry. Since this field requires precise processing and meticulous material handling, accurate material supply is essential for product performance and yield.

Acrylic resin, Urethane acrylate, Epoxy acrylate

Display

Dispensing equipment plays a crucial role in manufacturing high-resolution, high-quality displays such as OLED, LCD, and microLED in the display industry. Since this field requires precise processing and meticulous material handling, accurate material supply is essential for product performance and yield.

Acrylic resin, Urethane acrylate, Epoxy acrylate