Taeha Corporation

Die Bonding

A die is a small semiconductor chip that is a core component of electronic parts or integrated circuits.
Die bonding is a manufacturing process used in semiconductor packaging, where a die or chip is attached to a substrate or package using materials such as epoxy. This process securely attaches the die to the package, providing electrical and mechanical connections, and allows for heat transfer between the package and the die.

Applicable Materials

Epoxy, Solder Paste, Conductive Adhesive, etc.

Underfill Dispensing

This refers to a method of completely filling the space under packages such as BGA, CSP, and Flip Chip with insulating resin. Underfill is located between the silicon chip and the organic substrate in electronic packages, redistributing the stress and deformation caused by the difference in thermal expansion coefficients between the chip and substrate, while also minimizing the effects of moisture and other electrical and magnetic environments on the modules.

Applicable Materials

Epoxy, Anisotropic Conductive Film (ACF)

Encapsulation

The "Encapsulation" process, which seals the package, is a process that encases semiconductor chips in specific materials to protect them from external environments. The encapsulation process is particularly crucial in displays, especially OLEDs. Since OLEDs are vulnerable to moisture and oxygen, the encapsulation process is essential to prevent these issues.

Applicable Materials

Acrylic, Silicone, Polyurethane, etc.

Conformal Coating

Conformal coating is a process that forms a very thin layer of coating on PCBs and various electronic boards, helping to extend the lifespan of circuit components by protecting them from external environmental factors and physical impacts. The conformal coating process protects PCBs from humidity and contamination, prevents electrical insulation issues, and stops corrosion of components and solder joints. Additionally, it protects circuits and components from wear and solvents.

Applicable Materials

acrylic,silicone,polyurethane

Solder Paste Dispensing

Solder paste dispensing is a key equipment that enhances the precision and reliability of PCB assembly in the electronics industry, especially essential for modern electronic product manufacturing that requires miniaturization and high-density mounting. It is mainly used in SMT to secure components to the substrate, where precision and speed are critical requirements.

Applicable Materials

Solder Paste

TIM Dispensing

Efficiently managing heat generated in electronic devices is essential to prevent damage, maintain performance, and extend lifespan. If heat management is not properly executed, it can lead to component failure, decreased device performance, and increased power consumption. Thermal interface materials are very important for improving heat transfer between components and enhancing the efficiency of thermal management in electronic devices.

Applicable Materials

Epoxy, Solder Paste, Conductive Adhesive, etc.

Display

The dispensing equipment in the display industry plays an essential role in manufacturing high-resolution, high-quality displays (such as OLED, LCD, and microLED). This field requires fine processes and precise material handling, so the accurate supply of materials determines product performance and yield.

Applicable Materials